Automated deep access ball bonder for MEMS packaging based on fast autofocus system

Ball bonding is one of the most commonly used form of packaging of the MEMS sensors. Batch fabrication of the conventional IC ball bonding equipment characteristics limit the flexibility of the MEMS packaging. Continuous zoom microscope as a flexible micro-vision system and the combination of manual ball bonder, automatic ball bonding system for MEMS packaging is established. By analyzing the zoom microscope imaging model, zoom microscope auto-focusing method is put forward to obtaining a clear picture of different multiples. The rough location of large-scale is achieved under low magnification, high magnification for precise positioning, using the zoom microscope continuous variable characteristics to realize a wide range of high-precision positioning. Finally, MEMS pressure sensor packaging experiments verify the system´s utility.