Title :
Molengineered material solutions for today´s opportunities in photonic-microelectronic integration
Author_Institution :
Ionic Syst. Inc., San Jose, CA
Abstract :
Molecularly engineered materials provide a bridge for monolithic active and passive photonic-microelectronic integration. This paper updates work on molengineered materials that span material and process gaps across conventional techniques from CMOS microelectronics to polymer photonics
Keywords :
CMOS integrated circuits; integrated optics; micro-optics; optical fabrication; optical materials; CMOS microelectronics; active structure fabrication; molecular engineered materials; passive structure fabrication; photonic-microelectronic integration; polymer photonics; span material; Assembly; CMOS process; Fabrication; Foundries; Manufacturing processes; Microelectronics; Optical interconnections; Optical materials; Photonics; Silicon;
Conference_Titel :
Lasers and Electro-Optics Society, 2006. LEOS 2006. 19th Annual Meeting of the IEEE
Conference_Location :
Montreal, Que.
Print_ISBN :
0-7803-9555-7
Electronic_ISBN :
0-7803-9555-7
DOI :
10.1109/LEOS.2006.278755
