A novel resin composition for low Dk copper clad laminate

Author

Lu, June-che ; Hwang, Yeong-tong

Author_Institution

Tech. Dept. of Epoxy Resin, Nan Ya Plastic Corp., Taipei, Taiwan

fYear

2009

fDate

21-23 Oct. 2009

Firstpage

251

Lastpage

253

Abstract

Recently, high frequency signal transmission has been widely used in communication and broadband technologies, and even in mini-electronic devices. When signals travel at a high speed, how to maintain signal integrity becomes an important issue. Therefore, the electric properties in terms of dielectric constant (Dk) and loss factor (Df) of laminate materials for PCB production are more and more concerned. In our newly developed composition containing an epoxy resin, the epoxy resin has a molecular segment with low polarity in the polymer chain where the molecular segment is composed of a structure derived from a symmetric and saturated cycloaliphatic. The structure will reduce the dipole moment of the epoxy resin, so that the copper clad laminate produced from the composition containing the epoxy resin can have a low Dk and low Df.

Keywords

claddings; copper; dielectric losses; laminates; permittivity; polymers; printed circuits; resins; Cu; PCB production; copper clad laminate; dielectric constant; dielectric loss factor; epoxy resin; high-frequency signal transmission; low Dk copper clad laminate; molecular segment; polymer chain; printed circuit board production; resin composition; saturated cycloaliphatic structure; signal integrity; symmetric structure; Broadband communication; Communications technology; Copper; Dielectric constant; Dielectric losses; Dielectric materials; Epoxy resins; Frequency; Laminates; Production;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International

Conference_Location

Taipei

Print_ISBN

978-1-4244-4341-3

Electronic_ISBN

978-1-4244-4342-0

Type

conf

DOI

10.1109/IMPACT.2009.5382128

Filename

5382128