• DocumentCode
    3129734
  • Title

    Stretchable circuit board technology in textile applications

  • Author

    Ostmann, Andreas ; Vieroth, Rene ; Seckel, Manuel ; Löher, Thomas ; Reichl, Herbert

  • Author_Institution
    Fraunhofer IZM, Berlin, Germany
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    216
  • Lastpage
    219
  • Abstract
    Today´s electronic systems are based on an assembly of components onto rigid or flexible substrates, serving perfectly the needs of traditional product fields like automotive, computing or industry electronics. On the other hand, many of the demands from emerging applications like wearable and textile electronics cannot be met if standard technologies are used for their realization. These new fields have therefore become mayor drivers for the development of novel technologies. Among these `stretchable electronics´ have attracted strong attention. Especially for textile applications the potential of electronic systems to comply with the body shape and movement will improve the user comfort dramatically. A manufacturing technology for the realization of stretchable systems by common printed circuit board techniques, based on polyurethane as a stretchable matrix material has been developed. The stretchable circuit board technology has been used to realize a number of textile applications. As an example the realization of a fashion dress with integrated high brightness LEDs and movement sensing will be described.
  • Keywords
    flexible electronics; light emitting diodes; printed circuits; textiles; integrated high brightness LED; manufacturing technology; movement sensing; polyurethane; printed circuit board techniques; stretchable circuit board technology; stretchable electronics; stretchable matrix material; textile applications; Assembly systems; Automotive engineering; Computer industry; Driver circuits; Electronics industry; Flexible printed circuits; Industrial electronics; Integrated circuit technology; Printed circuits; Textile technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382138
  • Filename
    5382138