The thermal analysis of sequential LED driven mode

In this study, we use a LED die bordered with several LED chips and attached heat removal system for cooling. The commercially available CFD code, IcePak, is used to simulate the thermal behavior among the LED(heat source) , heat sink base and fin structure. There are 36 LED lamps located at the LED panel for Full-Load and Partial-Load(Sequential) power consumption. The sequential mode trigger on the LED 7 ms and shut off it 9 ms. the LED dies dissipate 8 W for heat. The simulation results represent the sequential mode reduces the temperature arise and increase the uniformity of the temperature. The heat sink received the thermal pulse and transmits it to the end of the sinks; the sequential mode has less temperature rise of it. The temperature rise among the LED lamps independents on the both modes. Depend on the results, the uniformity of the LED thermal module is different from that two modes. The Partial-Load induces the lower temperature and more alike distribution nearby. It will stabilize the LED wavelength and color temperature.