Title :
Session 6: 3D interconnection
Abstract :
Start of the above-titled section of the conference proceedings record.
Keywords :
Chemicals; Copper; Data mining; Filling; Silicon; Stacking; Through-silicon vias;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
DOI :
10.1109/IMPACT.2009.5382150
