DocumentCode :
3130022
Title :
Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy
Author :
Liang, You-Chun ; Chen, Chih
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
158
Lastpage :
161
Abstract :
In this study, the temperature map distribution in the Sn3.0Ag0.5Cu solder bump with Cu column under current stressing is directly examined using infrared microscopy. It is the radiance changes between the different materials of the surface that cause the unreasonable temperature map distribution. By coating a thin layer of black optical paint which is in order to eliminate the radiance changes, we got the corrected temperature map distribution. Under a current stress of 1.15 × 104 A/cm2 at 100°, the hot-spot temperature is 132.2°C which surpasses the average Cu column temperature of 129.7°C and the average solder bump temperature of 127.4°C. It is interesting that there are two modes of temperature distribution in the Cu column and in the solder bump, respectively.
Keywords :
copper alloys; flip-chip devices; optical microscopy; silver alloys; solders; temperature distribution; temperature measurement; tin alloys; Sn-Ag-Cu; current stressing; flip-chip solder joints; hot-spot temperature measurement; infrared microscopy; optical paint; temperature 127.4 degC; temperature 129.7 degC; temperature 132.2 degC; temperature map distribution; Current measurement; Flip chip solder joints; Microscopy; Stress measurement; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
Type :
conf
DOI :
10.1109/IMPACT.2009.5382153
Filename :
5382153
Link To Document :
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