Title :
Optimization of copper pillar bump design for fine pitch flip-chip packages
Author :
Lee, Meng Tsung ; Jung Pang Huang ; Lin, G.T. ; Lin, Y.H. ; Jiang, Yih Jenn ; Chiu, Steve ; Huang, Jung Pang
Author_Institution :
Siliconware Precision Ind., Taichung, Taiwan
Abstract :
In this paper we present new approaches in the development of flip chip technology. We assess the challenges presented by micro bump interconnection. In order to study that we have evaluated different bump designs of stagger 50 um pitch using different flip-chip packages methods Mold Under-filling (MUF) & Capillary Under-filling (CUF). (Figure 1) Finally this paper will conclude by identifying the most robust Cu pillar bump design for fine pitch FCCSP devices.
Keywords :
copper; fine-pitch technology; flip-chip devices; integrated circuit interconnections; Cu; FCCSP device; capillary under-filling; fine pitch flip-chip packages; micro bump interconnection; mold under-filling; pillar bump design; size 50 mum; Copper; Design optimization; Packaging;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
DOI :
10.1109/IMPACT.2009.5382161
