DocumentCode
3130199
Title
Optimization of copper pillar bump design for fine pitch flip-chip packages
Author
Lee, Meng Tsung ; Jung Pang Huang ; Lin, G.T. ; Lin, Y.H. ; Jiang, Yih Jenn ; Chiu, Steve ; Huang, Jung Pang
Author_Institution
Siliconware Precision Ind., Taichung, Taiwan
fYear
2009
fDate
21-23 Oct. 2009
Firstpage
128
Lastpage
131
Abstract
In this paper we present new approaches in the development of flip chip technology. We assess the challenges presented by micro bump interconnection. In order to study that we have evaluated different bump designs of stagger 50 um pitch using different flip-chip packages methods Mold Under-filling (MUF) & Capillary Under-filling (CUF). (Figure 1) Finally this paper will conclude by identifying the most robust Cu pillar bump design for fine pitch FCCSP devices.
Keywords
copper; fine-pitch technology; flip-chip devices; integrated circuit interconnections; Cu; FCCSP device; capillary under-filling; fine pitch flip-chip packages; micro bump interconnection; mold under-filling; pillar bump design; size 50 mum; Copper; Design optimization; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location
Taipei
Print_ISBN
978-1-4244-4341-3
Electronic_ISBN
978-1-4244-4342-0
Type
conf
DOI
10.1109/IMPACT.2009.5382161
Filename
5382161
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