DocumentCode :
3130516
Title :
Issues in path toward low cost three-axis accelerometer for low-g application
Author :
Chen, Jen-Yi ; Liao, L.P. ; Chien, H.T. ; Lin, C.S. ; Hsu, Y.W.
Author_Institution :
Microsyst. Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
297
Lastpage :
300
Abstract :
The paper presents issues for an optimized three-axis accelerometer implementation. A VerilogA model was built for sensor design, the overall sensitivity, noise and frequency response are obtained by co-simulation with circuit tools. The critical parameters were optimized by theoretical calculation and fine tuned by finite-element-analysis (FEA) and integrated nodal simulation. Three spring-proof mass systems were integrated on a single structure in size of 1.3 × 1.28 mm2 for operating range of ±2g. A silicon-on-glass (SOG) process is adopted to achieve the high aspect-ratio structure, yielding excellent Z-axis sensitivity and resolution as high as 1.434 V/g and 49 ¿g/¿Hz. The sensitivity and minimum cross-axis sensitivity are 1.442 V/g and 0.03% for x-axis and are 1.241 V/g and 0.21% for y-axis. This optimized design demonstrates excellent performance satisfying the needs of consumer applications.
Keywords :
accelerometers; finite element analysis; hardware description languages; sensitivity analysis; FEA; VerilogA model; circuit tools; consumer applications; finite-element-analysis; frequency response; integrated nodal simulation; silicon-on-glass process; spring-proof mass systems; three-axis accelerometer; Accelerometers; Costs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
Type :
conf
DOI :
10.1109/IMPACT.2009.5382175
Filename :
5382175
Link To Document :
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