DocumentCode :
3130670
Title :
10 W GaInP/GaAs power HBTs for base station applications
Author :
Kurpas, P. ; Maassdorf, Andre ; Doser, W. ; Heymann, P. ; Janke, B. ; Schnieder, F. ; Blanck, H. ; Auxemery, P. ; Pons, D. ; Heinrich, W. ; Wurfl, J.
Author_Institution :
Ferdinand-Braun-Inst. fur Hochsfrequenstech., Berlin, Germany
fYear :
2002
fDate :
8-11 Dec. 2002
Firstpage :
681
Lastpage :
684
Abstract :
Reports on GaInP/GaAs HBTs suitable for high voltage operation as required for base station amplifiers. The high breakdown voltages are achieved by adjusting thickness and doping level of the collector layer. Record BV/sub cbo/ and BV/sub ceo/ values of 80 V and 47 V, respectively, are obtained for a 3.5 /spl mu/m thick collector doped to 4 /spl times/ 10/sup 15/ cm/sup -3/. In order to realize the very high transistor mesa of more than 5 /spl mu/m reliably, the standard HBT process was modified. HBT operation at 2 GHz for high supply voltages up to 32V is demonstrated. Good RF performance is confirmed by f/sub T/ values higher than 20 GHz and usable current densities in excess of 1 /spl times/ 10/sup 4/ A/cm/sup 2/. Power HBTs with an emitter area of up to 5000 /spl mu/m/sup 2/ deliver 10 W of output power at 2 GHz with high efficiencies (PAE=50-79%) and 8-13 dB gain. Compared to LDMOS devices, these power HBTs exhibit a much larger output impedance (e.g., 20 /spl Omega/ for a 4000 /spl mu/m/sup 2/ device), which facilitates combining to very large power amplifiers. Heat-sinking strategies for high power HBTs are discussed based on power results and thermal simulations.
Keywords :
III-V semiconductors; UHF bipolar transistors; current density; gallium arsenide; gallium compounds; heterojunction bipolar transistors; indium compounds; power bipolar transistors; semiconductor device breakdown; semiconductor device models; semiconductor device packaging; 10 W; 2 GHz; 3.5 micron; 47 V; 50 to 79 percent; 8 to 13 dB; 80 V; GaInP-GaAs; GaInP/GaAs; RF performance; base station applications; breakdown voltages; current densities; doping level; emitter area; heat-sinking strategies; high voltage operation; output impedance; power HBTs; thermal simulations; transistor mesa; Base stations; Current density; Doping; Gallium arsenide; Heterojunction bipolar transistors; Operational amplifiers; Power amplifiers; Power generation; Radio frequency; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2002. IEDM '02. International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7462-2
Type :
conf
DOI :
10.1109/IEDM.2002.1175930
Filename :
1175930
Link To Document :
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