DocumentCode
3130880
Title
Welcome message from K. N. Chiang, conference co-chair
Author
Chiang, K.N.
Author_Institution
IMAPS-Taiwan
fYear
2009
fDate
21-23 Oct. 2009
Firstpage
1
Lastpage
1
Abstract
As a co-program chair of IMPACT2009 and on behalf of IMAPS-Taiwan and Advanced Packaging Research Center of National Tsing Hua University (APRC- NTHU), it is my great pleasure to welcome you all for coming Taipei, to the 4th IMPACT conference. The value of this conference lies in the opportunity it provides for an in-depth dialogue between the academia/research institution and the industry, the PCB society and the packaging/MEMS societies. This annual conference has already established itself as a key event in the advanced packaging, MEMS and PCB related areas, I am sure we´re all looking forward to some of the programs that have been scheduled. In the meantime, I very much hope that your participation in this conference will be both beneficial and enjoyable, and particularly for those of you from oversea, I trust that your stay here will be a pleasant one. Finally, I would like to acknowledge the efforts of the various parties such as ITRI, IMAPS-Taiwan, APRC-NTHU and TPCA, etc. in organizing this conference.
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location
Taipei
Print_ISBN
978-1-4244-4341-3
Electronic_ISBN
978-1-4244-4342-0
Type
conf
DOI
10.1109/IMPACT.2009.5382192
Filename
5382192
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