• DocumentCode
    3131285
  • Title

    Electrochemical corrosion behavior of Pb-free solders for die attachment

  • Author

    Tsai, Chi-Hang ; Song, Jenn-Ming ; Fu, Yen-Pei

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Dong Hwa Univ., Hualien, Taiwan
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    448
  • Lastpage
    451
  • Abstract
    This study aimed to investigate the electrochemical corrosion behavior of the potential Pb-free solders, Bi-11 wt%Ag and Zn-40 wt%Sn, in 3.5% NaCl solution using the potentiodynamic polarization method with the scanning range from -2000 mV to +2000 mV. Pb-5 wt%Sn alloy was also examined for comparison. Experimental results show that the corrosion potential (Ecorr) decreased in the decreasing order was Bi-11Ag, Pb-5Sn, and Zn-40Sn. Zn-40Sn exhibited the highest current density (Icorr), and that for Pb-5Sn was the lowest. The Pb-5Sn samples had a much extended passive region compared to Bi-11Ag, while the Zn-40Sn samples showed no passive behavior within the scanning range. According to the XPS and XRD data, the corrosion products were main PbCl2 and PbO for Pb-5Sn, BiOCl, AgCl2, and Bi2O3 for Bi-11Ag. Zn rich phases (ZnO and ZnCl2) were found on the polarized surface of Zn-40Sn, and tin oxides were detected at the subsurface.
  • Keywords
    X-ray diffraction; X-ray photoelectron spectra; bismuth alloys; corrosion; current density; electrochemistry; microassembling; silver alloys; solders; tin alloys; zinc alloys; BiAg; Pb-free solders; XPS data; XRD data; ZnSn; corrosion potential; current density; die attachment; electrochemical corrosion behavior; potentiodynamic polarization method; Copper; Corrosion; Environmentally friendly manufacturing techniques; Failure analysis; Lead; Shape control; Thin films; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382213
  • Filename
    5382213