Title :
Session 16: Novel thermal materials
Abstract :
Start of the above-titled section of the conference proceedings record.
Keywords :
Chemical engineering; Chemical industry; Chemical technology; Composite materials; Materials science and technology; Organic materials; Semiconductor materials; Thermal conductivity; Thermal engineering; Thermal management;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
DOI :
10.1109/IMPACT.2009.5382214
