• DocumentCode
    3131329
  • Title

    Large-scale preparation of ternary BiSbTe films with enhanced thermoelectric properties using DC magnetron sputtering

  • Author

    Fang, Wei-Chuan ; Liou, Kuen-Ming ; Leu, Min-Sheng

  • Author_Institution
    Mater. & Chem. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    457
  • Lastpage
    460
  • Abstract
    Large-scale synthesis of BiSbTe films with enhanced electrical property and Seebeck coefficient has been demonstrated in this work. As-grown BiSbTe films are found to have lower carrier concentration and higher electron mobility after the post annealing fulfilled. From the resultant high-resolution transmission electron microscope (HRTEM) images, the phenomenon of annealing-induced preferential Sb diffusion is corroborated to elaborate the reason why electrical properties could be improved. Moreover, the precipitation of Sb-rich phase is embedded in the thermally-treated BiSbTe films. Such the feasibility of large-scale fabrication of BiSbTe films with the elevated power factor is evidenced and this is very promising in the realization of room-temperature thermoelectric (TE) applications with high performances.
  • Keywords
    Seebeck effect; antimony compounds; bismuth compounds; carrier density; electron mobility; rapid thermal annealing; sputter deposition; thermoelectricity; transmission electron microscopy; BiSbTe; DC magnetron sputtering; Seebeck coefficient; carrier concentration; electron mobility; high-resolution transmission electron microscopy; large-scale fabrication; large-scale preparation; post annealing; room-temperature thermoelectric applications; thermally-treated films; Annealing; Electron mobility; Fabrication; Large-scale systems; Magnetic properties; Reactive power; Sputtering; Tellurium; Thermoelectricity; Transmission electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382216
  • Filename
    5382216