• DocumentCode
    3131384
  • Title

    Welcome message from An-Yeu Wu, conference co-chair

  • Author

    Wu, An-Yeu

  • Author_Institution
    Semiconductor Industry, Promotion Office (SIPO), Industrial Development Bureau, MOEA, Taiwan
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Thank you for participating in IMPACT Conference 2009 and International 3D IC Conference. Due to the trend of 3D IC technology and development are discussed popularly in the world; SIPO especially holds this joint conference with IMPACT to introduce more about 3D IC technology in this conference.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382219
  • Filename
    5382219
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3131384