Title :
The value of statistical testing for quality, yield and test cost improvement
Author :
Madge, R. ; Benware, B. ; Ward, M. ; Daasch, R.
Author_Institution :
LSI Logic Corp., Gresham, OR
Abstract :
This paper is the third in a lecture series on statistical analysis of semiconductor test data. Statistical test methods offer increased value in IC manufacturing and test over traditional maverick silicon screening methods by optimizing the trade-off between yield and reliability in deep sub-micron CMOS technologies. Effective use of the vast volume of data generated by test can lead to cost-effective screening of subtle defects, burn-in reduction or elimination and test cost reduction through adaptive test
Keywords :
cost reduction; integrated circuit testing; integrated circuit yield; production testing; statistical analysis; IC manufacturing; adaptive test; burn-in reduction; quality improvement; semiconductor test data; statistical testing; test cost improvement; yield improvement; CMOS technology; Costs; Integrated circuit testing; Large scale integration; Logic design; Logic testing; Materials testing; Semiconductor device testing; Silicon; Statistical analysis;
Conference_Titel :
Test Conference, 2005. Proceedings. ITC 2005. IEEE International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-9038-5
DOI :
10.1109/TEST.2005.1583990
