DocumentCode :
3131460
Title :
Base material consideration for high speed printed circuit boards
Author :
Liu, Annie ; Liao, Eric
Author_Institution :
Taiwan Union Technol. Corp., Chupei, Taiwan
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
478
Lastpage :
480
Abstract :
To take our responsibility of reducing harm to our environment, EU RoHS restriction about lead-free capability is one of considered tasks for us to follow up. Additionally, the tendency shows that more and more demands of the higher signal transmission speed in various field of applications, and the demand of frequency shifts from 1-5 Gbps range to 5-10 Gbps depending on the applications. Recently the material improvement on lead-free process favored and better signal integrity performed laminate materials seems to be critical and sensitive to choose a moderate resin system. Considering the electrical, thermal performances and the cost effectiveness, we discuss the resulted performance from the point of view of laminate composition, such as resin, laminate construction, and some environment factors etc. combined with a massive mainstream application and low-loss application under the hypothesis of lead-free capability.
Keywords :
laminates; printed circuit manufacture; resins; EU RoHS restriction; base material consideration; bit rate 1 Gbit/s to 10 Gbit/s; high speed printed circuit boards; laminate composition; lead-free process; moderate resin system; signal integrity; signal transmission speed; Printed circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
Type :
conf
DOI :
10.1109/IMPACT.2009.5382223
Filename :
5382223
Link To Document :
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