Time dependent deformation behavior of interfacial intermetallic compounds in electronic solder joints

This study evaluated room temperature creep properties of the intermetallic compounds (IMCs) formed at the interfaces between Pb-free solders (Sn-Ag-Cu and Sn-Zn) and the commonly used electronic substrates (Cu, Ni and Ag) using nanoindentation. The creep stress exponent (CSE), representing creep resistance, in the decreasing order was Cu, Ni and then Ag based IMCs, which was in good agreement with tendencies of the work hardening exponent (n) and the ratio of yield stress (Y) to Young´s modulus (E) as well.