• DocumentCode
    3131754
  • Title

    Interfacial toughness evaluation of SAC305 solder bump with pendulum impact test

  • Author

    Tai, F.C. ; Duh, J.G.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Tsing-Hua Univ., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    541
  • Lastpage
    544
  • Abstract
    The high impact speeds (200, 1000 mm/s) in the pendulum test were conducted on the SAC305/ENIG joints aged at 150°C for 500 and 1000 h, respectively. The preliminary results exhibit that the peak force, pre-peak energy and total impact energy except post-energy of as-reflowed are larger than those of as-aged samples regardless of aging time. For the as-reflowed SAC305/ENIG joint (0.3 mm at diameter), the peak force is 2.592 N at the speed of the 1000 mm/s; the impact toughness is 0.168 mJ and the total impact energy is 0.345 mJ. Fracture mode also reveals the typical IMC fracture.
  • Keywords
    copper alloys; fracture; impact testing; reflow soldering; silver alloys; solders; tin alloys; IMC fracture; SAC305 solder bump; SnAgCu; as-reflowed SAC305/ENIG joint; fracture mode; impact toughness; interfacial toughness evaluation; pendulum impact test; temperature 150 degC; time 1000 h; time 500 h; Accelerometers; Aging; Bonding; Gold; Optical microscopy; Packaging; Performance evaluation; Soldering; Springs; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382239
  • Filename
    5382239