Title :
Interfacial toughness evaluation of SAC305 solder bump with pendulum impact test
Author :
Tai, F.C. ; Duh, J.G.
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Tsing-Hua Univ., Hsinchu, Taiwan
Abstract :
The high impact speeds (200, 1000 mm/s) in the pendulum test were conducted on the SAC305/ENIG joints aged at 150°C for 500 and 1000 h, respectively. The preliminary results exhibit that the peak force, pre-peak energy and total impact energy except post-energy of as-reflowed are larger than those of as-aged samples regardless of aging time. For the as-reflowed SAC305/ENIG joint (0.3 mm at diameter), the peak force is 2.592 N at the speed of the 1000 mm/s; the impact toughness is 0.168 mJ and the total impact energy is 0.345 mJ. Fracture mode also reveals the typical IMC fracture.
Keywords :
copper alloys; fracture; impact testing; reflow soldering; silver alloys; solders; tin alloys; IMC fracture; SAC305 solder bump; SnAgCu; as-reflowed SAC305/ENIG joint; fracture mode; impact toughness; interfacial toughness evaluation; pendulum impact test; temperature 150 degC; time 1000 h; time 500 h; Accelerometers; Aging; Bonding; Gold; Optical microscopy; Packaging; Performance evaluation; Soldering; Springs; Testing;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
DOI :
10.1109/IMPACT.2009.5382239