DocumentCode
3131785
Title
Session 20: Green materials & process II
fYear
2009
fDate
21-23 Oct. 2009
Firstpage
545
Lastpage
545
Abstract
Start of the above-titled section of the conference proceedings record.
Keywords
Environmentally friendly manufacturing techniques; Glass industry; Inductors; Light emitting diodes; Metals industry; Nanotechnology; Packaging; Q factor; Reliability engineering; Resins;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location
Taipei
Print_ISBN
978-1-4244-4341-3
Type
conf
DOI
10.1109/IMPACT.2009.5382240
Filename
5382240
Link To Document