DocumentCode :
3131861
Title :
Welcome message from Simon Chen, conference co-chair
Author :
Chen, Simon
Author_Institution :
Taiwan Printed Circuit Association, Taiwan
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
1
Lastpage :
1
Abstract :
On behalf of Taiwan Printed Circuit Association (TPCA), I warmly welcome your participation in IMPACT Conference 2009 and International 3D IC Conference. After one year preparation, the organizers aim to provide all attendees a various conference to meet the conference theme-“IMPACT Your Future: Integration, Efficiency, & the Eco-Friendly”.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
Type :
conf
DOI :
10.1109/IMPACT.2009.5382246
Filename :
5382246
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3131861
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