DocumentCode :
3131909
Title :
Session 21: Advanced cooling technology II
fYear :
2009
fDate :
21-23 Oct. 2009
Firstpage :
572
Lastpage :
572
Abstract :
Start of the above-titled section of the conference proceedings record.
Keywords :
Cooling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Type :
conf
DOI :
10.1109/IMPACT.2009.5382248
Filename :
5382248
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3131909