Title :
Effect of lead free solders on in-circuit test process
Author :
Reinosa, Rosa D.
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA
Abstract :
In response to the European Union Restriction of Hazardous Substances (RoHS) Directive which bans the use of lead in electronic equipment by July 1, 2006, the selection and use of new lead free solder alloys for the manufacturability of PCAs (printed circuit assemblies) are now requirements faced by many OEMs. HP´s transition to lead free manufacturing requires that the contact repeatability performance of lead free materials be assessed to ensure that the throughput of production lines or yields are not be affected during this transition. In-circuit test probe contact repeatability performance is presented for various lead free material combinations (paste, surface finish) and their impact on production test
Keywords :
hazardous materials; printed circuit manufacture; printed circuit testing; probes; production testing; solders; OEM; PCA; RoHS; contact repeatability performance; electronic equipment; in-circuit test process; lead free manufacturing; lead free materials; lead free solders; printed circuit assemblies; production test; Assembly; Circuit testing; Electronic equipment; Electronic equipment manufacture; Environmentally friendly manufacturing techniques; Lead; Materials testing; Principal component analysis; Printed circuits; Production;
Conference_Titel :
Test Conference, 2005. Proceedings. ITC 2005. IEEE International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-9038-5
DOI :
10.1109/TEST.2005.1584025
