• DocumentCode
    3132114
  • Title

    The application of UV-LEDs to printed circuit board process

  • Author

    Huang, Chen-Kang ; Sung, Jeng-Gang

  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    613
  • Lastpage
    616
  • Abstract
    This study investigated using high power UV light emitting diode (LED) to replace the traditional UV lamp in printed circuit board process. It was expected to take the advantages of energy conservation, long life and quick response of UV-LEDs. The feasibility of this replacement was evaluated. There were two kinds of light modules in this work; Type 1 composed of six 1-Watt UV-LEDs arranging as a circle of diameter in 50 mm. Type 2 was equipped with twelve 3-Watt LEDs soldered on a MCPCB of 100 mm in diameter. Both modules emitted a spectrum distribution peaking at a wavelength of 400 nm. The angle of view measuring apparatus was completed for measuring light module angle of view and UV intensity. In order to obtain collimated light source, the parabolic reflectors were used for Type 1. The reflectors showed the six to ten times enhancement of intensity and the improvement of the angle of view from 140° to 30°. In order to approach the practical process, only the original light source was replaced by UV-LED light modules. Other parameters on the automation system remained unchanged. After etching, the patterns were observed and measured by image measurement software. Following the PCB standards, only results with relative errors under 15% were accepted. At present, the minimum reproducible feature size is 75 ¿m by Type 2 light source with 50 mm or 100 mm distance between light source and mask. The results show the feasibility and potential usage of UV-LED in PCB lithography.
  • Keywords
    intensity measurement; light emitting diodes; optical elements; printed circuit manufacture; ultraviolet lithography; ultraviolet sources; MCPCB; PCB lithography; UV-LED light modules; collimated light source; energy conservation; etching; high power UV light diode; image measurement software; parabolic reflectors; power 1 W; power 3 W; printed circuit board process; size 100 mm; size 50 mm; spectrum distribution peaking; wavelength 400 nm; Automation; Energy conservation; Etching; Goniometers; Light emitting diodes; Light sources; Optical collimators; Printed circuits; Software measurement; Wavelength measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382259
  • Filename
    5382259