Title :
Horizontal systems: Leading technology for next generation HDI production
Author :
Kenny, Stephen ; Magaya, Tafadzwa
Author_Institution :
Atotech GmbH, Berlin, Germany
Abstract :
The developments in high density interconnect, HDI technology are characterized by the following: - Ever higher packaging density. - Reduction in line and space. - New dielectrics to meet high frequency demands. - Employment of thinner substrates. - Environmental and legislative impact. - Requirement for high overall process yields. - Demand for continuous reduction in process costs.
Keywords :
integrated circuit interconnections; integrated circuit packaging; environmental impact; high density interconnect; higher packaging density; horizontal systems; legislative impact; line reduction; process costs; space reduction; thinner substrates; Copper; Costs; Dielectric substrates; Drilling; Fiber lasers; Optical materials; Paper technology; Production systems; Space technology; Windows;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4341-3
Electronic_ISBN :
978-1-4244-4342-0
DOI :
10.1109/IMPACT.2009.5382265
