• DocumentCode
    3132523
  • Title

    Numerical and experimental study of thermal management on HB LED devices

  • Author

    Chu, Shao-Shu ; Wang, Yuen-Ting ; Selva, Carlos Fernando Moreira

  • Author_Institution
    Dept. of Mech. Eng., Kun Shan Univ., Yung-Kang, Taiwan
  • fYear
    2009
  • fDate
    21-23 Oct. 2009
  • Firstpage
    692
  • Lastpage
    696
  • Abstract
    A finite element method based on a direct algorithm is applied in this study to estimate the time-dependent and time-independent convection heat transfer of high-bright LED(HB LED) heat dissipating mechanisms. Numerically simulation and experimental measurement are both performed to investigate the thermal characteristics of HB LED devices. By monitoring the transient temperatures at the different measurement positions of the device, it is placed into well controlling ambient temperature environment when the LED is subjected to different thermal loading. Experimental data is subjected to the numerical tests in order to verify the accuracy of simulation models. Therefore, the thermal management of HB LED devices can be investigated. The results indicate that established models are not only proved to enhance heat dissipating of LED but also well consistency to the experimental data. Finally, a simple design of HB LED device is demonstrated to prove the success of this research and can it be applied in the present industry.
  • Keywords
    finite element analysis; heat transfer; light emitting diodes; finite element method; high-bright LED heat dissipating mechanisms; thermal management; time-dependent convection heat transfer; time-independent convection heat transfer; Finite element methods; Heat transfer; Light emitting diodes; Monitoring; Numerical simulation; Performance evaluation; Position measurement; Temperature measurement; Temperature sensors; Thermal management; HB LED; direct algorithm; heat transfer mechanisms; thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4341-3
  • Electronic_ISBN
    978-1-4244-4342-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2009.5382282
  • Filename
    5382282