A leakage control system for thermal stability during burn-in test

Author

Meterelliyoz, Mesut ; Mahmoodi, Hamid ; Roy, Kaushik

Author_Institution

Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN

fYear

2005

fDate

8-8 Nov. 2005

Lastpage

991

Abstract

Increase in leakage current with technology scaling has been a major problem for IC technology. This problem becomes more crucial during burn-in test where stressed voltage and temperature are applied. Due to presence of a positive feedback between major components of leakage and temperature in CMOS circuits, excessive leakage may lead to thermal runaway and yield loss during burn-in test. This paper describes a novel integrated leakage control system to ensure thermal stability during burn-in test for a wide range of ambient temperatures and process variations

Keywords

CMOS integrated circuits; integrated circuit testing; leakage currents; thermal stability; CMOS circuits; ambient temperature; burn-in testing; integrated leakage control system; leakage current; positive feedback; stressed temperature; stressed voltage; thermal runaway; thermal stability; yield loss; CMOS technology; Circuit stability; Circuit testing; Control systems; Feedback circuits; Leakage current; System testing; Temperature; Thermal stability; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 2005. Proceedings. ITC 2005. IEEE International

Conference_Location

Austin, TX

Print_ISBN

0-7803-9038-5

Type

conf

DOI

10.1109/TEST.2005.1584064

Filename

1584064