Testing throughput computing interconnect topologies with Tbits/sec bandwidth in manufacturing and in field

The next generation of throughput computing systems designed by Sun Microsystems require interconnect with bandwidth of the order of Tbits/sec. Interconnect topologies for such high bandwidth are based on a few hundred SerDes I/Os on chips operating at multi-Gbps. Testing of these I/Os at only the component level is inadequate. In this paper, we describe the design-for-testability features for system manufacturing and on-line test of such I/Os and interconnect