Title :
A static noise impact analysis methodology for evaluating transient error effects in digital VLSI circuits
Author :
Zhao, Chong ; Bai, Xiaoliang ; Dey, Sujit
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ. at San Diego, La Jolla, CA
Abstract :
Single-event-upset (SEU) has become a great threat to the reliability of nanometer circuits. The need for cost-effective robust circuit design mandates the development of efficient reliability analysis. In this paper, a static "noise impact analysis" methodology is developed to estimate the circuit vulnerability. First, both the circuit elements and the transient noise are abstracted in the format of matrices. Then the circuit-noise interaction is modeled by a series of matrix transformations, which jointly considers three masking effects that can potentially prevent transient noise from causing observable errors. Finally, the error-resiliency of the sequential elements is considered in determining the impact of transient noise on the circuit. Experiment results demonstrate that our technique can accurately yet quickly estimate the circuit failure rate by comparing with HSPICE simulation. The proposed methodology has greatly facilitate the economic design of robust nanometer circuit
Keywords :
VLSI; digital integrated circuits; fault tolerance; integrated circuit noise; integrated circuit reliability; matrix algebra; HSPICE simulation; circuit elements; circuit failure rate; circuit vulnerability; circuit-noise interaction; digital VLSI circuits; error-resiliency; masking effects; matrix transformations; nanometer circuit; sequential elements; static noise impact analysis methodology; transient error effects; transient noise; Circuit analysis; Circuit noise; Circuit simulation; Computer errors; Electromagnetic transients; Protection; Semiconductor device noise; Transient analysis; Very large scale integration; Working environment noise;
Conference_Titel :
Test Conference, 2005. Proceedings. ITC 2005. IEEE International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-9038-5
DOI :
10.1109/TEST.2005.1584071