Title :
Flip chip design rule development for multiple signal and ground bump configurations
Author :
Staiculescu, Daniela ; Laskar, Joy ; Tentzeris, Manos
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper presents a novel approach for analysis of factors to be considered when designing a flip chip package. The analysis is focused on the use of multiple signal and ground bumps and incorporates the design of an experiment and statistical analysis of the outputs. The multiple ground bump configurations use a modified coplanar waveguide (CPW) launch and improvement in electrical performance with the modified transmission line geometry is demonstrated. For the signal bumps on a traditional CPW launch, best performance is achieved with one bump and degraded for each additional bump. The approach is very flexible and this work represents a foundation for thorough design rule development for RF and microwave flip chip applications
Keywords :
UHF integrated circuits; coplanar waveguides; flip-chip devices; integrated circuit design; integrated circuit packaging; microwave integrated circuits; statistical analysis; 1 to 40 GHz; MIC; RF flip chip applications; coplanar waveguide launch; flip chip design rule development; flip chip package; microwave flip chip applications; modified CPW launch; modified transmission line geometry; multiple ground bump configurations; multiple signal bump configurations; statistical analysis; Coplanar transmission lines; Coplanar waveguides; Degradation; Flip chip; Geometry; Packaging; Radio frequency; Signal analysis; Signal design; Statistical analysis;
Conference_Titel :
Microwave Conference, 2000 Asia-Pacific
Conference_Location :
Sydney, NSW
Print_ISBN :
0-7803-6435-X
DOI :
10.1109/APMC.2000.925740
