DocumentCode :
3133041
Title :
Extension Engineering using Carbon co-Implantation Technology for Low Power CMOS Design with Phosphorus- and Boron-Extension
Author :
Momiyama, Y. ; Okabe, K. ; Nakao, H. ; Kojima, M. ; Kase, M. ; Sugii, T.
Author_Institution :
Fujitsu Ltd., Akiruno
fYear :
2007
fDate :
8-9 June 2007
Firstpage :
63
Lastpage :
64
Abstract :
We have developed a carbon (C) co-implantation technology that enables drastic improvement of Vth rolloff in nMOSFET having phosphorus (P) extension while maintaining the current drive, and reduces the extension sheet resistance in pMOSFET having boron (B) extension. The data revealed that C introduced into the extension region suppresses the P-extension tail for nMOSFET and improves B activation ratio for pMOSFET. We also found that combination of C and indium (In) pocket plays an important role for Vth rolloff improvement in nMOSFET.
Keywords :
CMOS integrated circuits; MOSFET; boron; carbon; elemental semiconductors; indium; ion implantation; phosphorus; semiconductor doping; silicon; B activation ratio; Si:B,C - Interface; Si:In,C - Interface; Si:P,C - Interface; boron-extension; carbon co-implantation technology; extension engineering; extension sheet resistance; indium pocket; low power CMOS design; nMOSFET; pMOSFET; phosphorus-extension; CMOS process; CMOS technology; Capacitance; Design engineering; Impurities; Laboratories; MOSFET circuits; Power engineering and energy; Tail; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2007 International Workshop on
Conference_Location :
Kyoto
Print_ISBN :
1-4244-1103-3
Electronic_ISBN :
1-4244-1104-1
Type :
conf
DOI :
10.1109/IWJT.2007.4279948
Filename :
4279948
Link To Document :
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