DocumentCode :
3133105
Title :
Molecular Dopants and High Mass Dopants for HALO and Extension Implantation
Author :
Mineji, Akira ; Borland, John ; Shishiguchi, Seiichi ; Hane, Masami ; Tanjyo, Masayasu ; Nagayama, Tsutomu
Author_Institution :
NEC Electron. Corp., Sagamihara
fYear :
2007
fDate :
8-9 June 2007
Firstpage :
73
Lastpage :
76
Abstract :
Diffusion-less activation were realized for the 650degC SPE, >1300degC flash and 900degC spike anneals. For pSDE all boron dopant species (BF2, B10H14 and B18H22) achieved high quality junctions with flash annealing. With 900degC spike either B10H14 or B18H22 can be used while with 650degC SPE annealing only B18H22 can be used. For pHALO using In no difference in activation level could be seen but significant differences in junction leakage was observed. No difference between BF2 and B10H14 HALO activation could be seen for each annealing condition and SPE annealing resulted in the worse activation level. For nSDE with flash annealing As, As2 and Sb activation levels were similar while P2 was 25% better. With SPE and 900degC spike Sb gave the best activation. For nHALO As, As2 and Sb activation levels were similar for all annealing conditions with SPE resulting in 2x lower activation. Doubling the As2 dose improved SPE activation by 2x.
Keywords :
antimony; arsenic; boron compounds; incoherent light annealing; indium; ion implantation; phosphorus; semiconductor doping; semiconductor junctions; HALO; SPE annealing; Si:As - Binary; Si:B - Binary; Si:P - Binary; Si:Sb - Binary; diffusion-less activation; extension implantation; flash annealing; high mass dopants; junction leakage; molecular dopants; spike annealing; temperature 650 C; temperature 900 C; Annealing; Boron; Degradation; Electrical resistance measurement; Electronic mail; Implants; Indium tin oxide; National electric code; Paper technology; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2007 International Workshop on
Conference_Location :
Kyoto
Print_ISBN :
1-4244-1103-3
Electronic_ISBN :
1-4244-1104-1
Type :
conf
DOI :
10.1109/IWJT.2007.4279952
Filename :
4279952
Link To Document :
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