DocumentCode
3133326
Title
Accurate Dose Control in High Pressure Condition on Medium Current Ion Implanters
Author
Sano, Makoto ; Sato, Fumiaki ; Sugitani, Michiro
Author_Institution
SEN Corp., Ehime
fYear
2007
fDate
8-9 June 2007
Firstpage
127
Lastpage
128
Abstract
On ion implantation, outgassing from photoresist coating wafer can induce a significant dose shift which can result in fluctuations of device characteristics within a wafer and/or in wafer-to-wafer. Pcomp, which is a system that compensates beam currents as a function of the beam line pressure, improves dose accuracy in implantation onto photoresist-coated wafers. Pcomp is effective even for medium current ion implanters as well as for batch-type implanters. It is also inevitable to use Pcomp on medium current implanters with high power beams, especially at a high energy region.
Keywords
boron; elemental semiconductors; ion implantation; photoresists; semiconductor doping; silicon; Si:B - Binary; accurate dose control; beam line pressure; dose accuracy; high pressure condition; medium current ion implanters; outgassing; photoresist coating wafer; pressure compensation system; Dosimetry; Electrical resistance measurement; Implants; Ion beams; Manufacturing; Pressure control; Resists; Shape; Surface resistance; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology, 2007 International Workshop on
Conference_Location
Kyoto
Print_ISBN
1-4244-1103-3
Electronic_ISBN
1-4244-1104-1
Type
conf
DOI
10.1109/IWJT.2007.4279965
Filename
4279965
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