• DocumentCode
    3133326
  • Title

    Accurate Dose Control in High Pressure Condition on Medium Current Ion Implanters

  • Author

    Sano, Makoto ; Sato, Fumiaki ; Sugitani, Michiro

  • Author_Institution
    SEN Corp., Ehime
  • fYear
    2007
  • fDate
    8-9 June 2007
  • Firstpage
    127
  • Lastpage
    128
  • Abstract
    On ion implantation, outgassing from photoresist coating wafer can induce a significant dose shift which can result in fluctuations of device characteristics within a wafer and/or in wafer-to-wafer. Pcomp, which is a system that compensates beam currents as a function of the beam line pressure, improves dose accuracy in implantation onto photoresist-coated wafers. Pcomp is effective even for medium current ion implanters as well as for batch-type implanters. It is also inevitable to use Pcomp on medium current implanters with high power beams, especially at a high energy region.
  • Keywords
    boron; elemental semiconductors; ion implantation; photoresists; semiconductor doping; silicon; Si:B - Binary; accurate dose control; beam line pressure; dose accuracy; high pressure condition; medium current ion implanters; outgassing; photoresist coating wafer; pressure compensation system; Dosimetry; Electrical resistance measurement; Implants; Ion beams; Manufacturing; Pressure control; Resists; Shape; Surface resistance; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology, 2007 International Workshop on
  • Conference_Location
    Kyoto
  • Print_ISBN
    1-4244-1103-3
  • Electronic_ISBN
    1-4244-1104-1
  • Type

    conf

  • DOI
    10.1109/IWJT.2007.4279965
  • Filename
    4279965