Title :
The ITC test compression shootout
Author_Institution :
Sun Microsystems, Inc., Sunnyvale, CA
Abstract :
As IC feature sizes shrink, density increases, and the number of gates and thus faults explode, we have managed to keep up by developing new fault models and new test generation approaches to detect these faults. Test data size grows with the size of the longest scan chain. Over the last few years many have proposed a solution in the form of test compression. The purpose of this panel is to compare compression methods
Keywords :
built-in self test; integrated circuit testing; IC; ITC test compression; fault models; longest scan chain; test data; Automatic testing; Built-in self-test; Circuit faults; Circuit testing; Costs; Electrical fault detection; Fault detection; Integrated circuit modeling; Integrated circuit testing; Sun;
Conference_Titel :
Test Conference, 2005. Proceedings. ITC 2005. IEEE International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-9038-5
DOI :
10.1109/TEST.2005.1584110
