• DocumentCode
    3133378
  • Title

    Planar InP burying growth around a dry-etched mesa by addition of CH3Cl during MOVPE

  • Author

    Takeuchi, T. ; Yamazaki, S.

  • Author_Institution
    Fujitsu Labs. Ltd., Atsugi, Japan
  • fYear
    1995
  • fDate
    9-13 May 1995
  • Firstpage
    291
  • Lastpage
    294
  • Abstract
    Planar burying growth of InP around a dry-etched stripe mesa has been made with metalorganic vapor phase epitaxy (MOVPE) by adding CH3Cl to the process gases. The planarization effect of CH 3Cl addition is striking especially in relatively low growth temperature conditions. From the growth behavior around mesas and a study of growth rate modifications, we consider that the migration enhancement of In atoms and the induced dependence of growth rate on the crystallographic orientation produces the planar burying growth. Using reactive ion etching (RIE) for mesa fabrication and adding CH3Cl in MOVPE growth, we demonstrated 1.5 μm InGaAsP/InP buried-heterostructure (BH) laser diodes with Fe doped semi-insulating InP layers. We obtained comparable laser characteristics with those of conventional wet-etched mesa laser diodes
  • Keywords
    III-V semiconductors; buried layers; indium compounds; semiconductor growth; semiconductor lasers; sputter etching; vapour phase epitaxial growth; 1.5 mum; 575 to 625 C; CH3Cl addition; In atom migration enhancement; InGaAsP-InP; InGaAsP/InP buried-heterostructure laser diodes; InP; InP:Fe; MOVPE; chloromethane; crystallographic orientation; dry-etched stripe mesa; growth rate modification; laser characteristics; low growth temperature conditions; mesa fabrication; metalorganic vapor phase epitaxy; planar burying growth; planarization effect; reactive ion etching; semi-insulating InP:Fe layers; Atomic beams; Crystallography; Diode lasers; Epitaxial growth; Epitaxial layers; Etching; Gases; Indium phosphide; Planarization; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1995. Conference Proceedings., Seventh International Conference on
  • Conference_Location
    Hokkaido
  • Print_ISBN
    0-7803-2147-2
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1995.522137
  • Filename
    522137