DocumentCode :
3133441
Title :
Heat Dissipation for LED Lighting: Vapor Chamber Substrate Printed Circuit Board
Author :
Huang, Zhong ; Cheng, Zhong ; Wu, Mingguang
Author_Institution :
Dept. of Control Sci. & Eng., Zhejiang Univ., Hangzhou, China
fYear :
2010
fDate :
15-17 June 2010
Firstpage :
565
Lastpage :
570
Abstract :
Heat dissipation is an inevitable subject during the design of light emitting diode (LED) lighting, especially for museums and medical equipment. In this paper, a novel substrate technology for an effective solution to two major problems that affect the heat dissipation performance has been introduced. (1) The non-uniform junction temperature of the module across the LED arrays and the uneven operational temperature of LED arrays; (2) The high operational temperature caused by the accumulated heat. This new type of Vapor chamber substrate printed circuit board (PCB) consists of a thermally-conductive Vapor chamber substrate which is insulated by a dielectric layer of aluminum nitride (ALN). Circuit is formed on the dielectric layer with pulse magnetron sputtering technology. Experimental results in the form of average temperature show that the vapor chamber substrate PCB can improve the temperature uniformity. And good thermal performance for high power LED arrays can also be achieved.
Keywords :
cooling; heat transfer; light emitting diodes; lighting; p-n junctions; printed circuits; sputtering; substrates; LED arrays; LED lighting; PCB; aluminum nitride; dielectric layer; heat dissipation; light emitting diode; nonuniform junction temperature; pulse magnetron sputtering; thermally-conductive vapor chamber substrate; vapor chamber substrate printed circuit board; Aluminum nitride; Biomedical equipment; Dielectric substrates; Dielectrics and electrical insulation; LED lamps; Light emitting diodes; Magnetic circuits; Printed circuits; Pulse circuits; Temperature; LED; heat dissipation; magnetron sputtering technology; vapor chamber substrate PCB;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics and Applications (ICIEA), 2010 the 5th IEEE Conference on
Conference_Location :
Taichung
Print_ISBN :
978-1-4244-5045-9
Electronic_ISBN :
978-1-4244-5046-6
Type :
conf
DOI :
10.1109/ICIEA.2010.5517072
Filename :
5517072
Link To Document :
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