Title :
Partnering with customer to achieve high yield
Author_Institution :
Taiwan Semicond. Manuf. Co., Hsinchu, OR
Abstract :
Even at increasing process challenge with nanometer technology at 90nm, TSMC is able to achieve much faster defect density improvement than previous generations of technologies. One of the main reasons for faster 90nm yield ramp is TSMC´s Advanced Failure Analysis infrastructure that is being established over time and has become sophisticated and rigorous recently. More importantly, the strong partnership between TSMC and its customers makes the defect localization much more efficiently. And the strong partnership with customers is the key for the overall success of foundry business model
Keywords :
failure analysis; integrated circuit reliability; integrated circuit yield; 90 nm; TSMC advanced failure analysis; defect density improvement; defect localization; foundry business model; nanometer technology; Atomic force microscopy; Failure analysis; Foundries; Leakage current; Manufacturing processes; Nanoscale devices; Semiconductor device manufacture; Signal to noise ratio; Testing; Vehicles;
Conference_Titel :
Test Conference, 2005. Proceedings. ITC 2005. IEEE International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-9038-5
DOI :
10.1109/TEST.2005.1584130
