Title :
Long term noise measurements to characterize electromigration in metal lines of ICs
Author :
Ciofi, C. ; Dattilo, V. ; Neri, B. ; Foley, S. ; Mathewson, A.
Author_Institution :
INMF, Sant´´Agata, Italy
Abstract :
In this paper, the results obtained by performing noise measurements during lifetime tests of metal lines subject to electromigration are presented. One of the aims of this work is to investigate the possibility of establishing a new failure criterion based on noise measurement capable of providing, in a shorter time, the same type of information normally obtained from MTF (median time to failure) tests
Keywords :
electric noise measurement; electromigration; failure analysis; integrated circuit interconnections; integrated circuit measurement; integrated circuit metallisation; integrated circuit noise; integrated circuit reliability; life testing; IC metal lines; MTF tests; electromigration; failure criterion; lifetime tests; long term noise measurements; median time to failure tests; metal lines; noise measurements; 1f noise; Electromigration; Fluctuations; Lifetime estimation; Metallization; Noise measurement; Performance evaluation; Stress; Temperature; Testing;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 1999. Proceedings of the 1999 7th International Symposium on the
Print_ISBN :
0-7803-5187-8
DOI :
10.1109/IPFA.1999.791321
