DocumentCode
3133866
Title
A novel dual-direction IC ESD protection device
Author
Wang, Albert Z. ; Tsay, Chen H. ; Shan, Qing W.
Author_Institution
Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
fYear
1999
fDate
1999
Firstpage
151
Lastpage
155
Abstract
We report the design of a novel dual-direction on-chip IC electrostatic discharge (ESD) protection device. The design was predicted by simulation, matched by measurements and features a high ESD-Si ratio of ~80 V/μm, deep snapback, low Ron of 0.64 Ω, low leakage (~pA), adjustable triggering voltage, and good scalability
Keywords
circuit simulation; electrostatic discharge; integrated circuit measurement; integrated circuit reliability; leakage currents; protection; 064 ohm; ESD-Si ratio; adjustable triggering voltage; design prediction; device measurements; dual-direction IC ESD protection device; dual-direction on-chip IC electrostatic discharge protection device; leakage current; on-resistance; scalability; simulation; snapback; Breakdown voltage; Clamps; Electrostatic discharge; Electrostatic interference; Electrostatic measurements; Impedance; Predictive models; Protection; Pulse measurements; Thyristors;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 1999. Proceedings of the 1999 7th International Symposium on the
Print_ISBN
0-7803-5187-8
Type
conf
DOI
10.1109/IPFA.1999.791325
Filename
791325
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