Title :
Low-voltage forward gated diode: an early monitor of hot-carrier degradations in scaled MOSFETs
Author :
Chen, Ming-Jer ; Kang, Ting-Kuo
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
A low-voltage gated diode biased in weak accumulation and forward mode exhibits a new potential in monitoring the hot-carrier induced degradations of MOSFETs. This is an ability to detect degradation much earlier than the other monitors currently utilized in the industry in terms of the drive capability Idsat and transconductance g m. The original abilities such as sensitive and nondestructive monitoring are preserved. These abilities are highlighted in 4.8 and 3.5 nm oxide CMOS manufacturing processes, eventually leading to a guideline using a forward gated-diode monitor for process evaluation with regard to hot-carrier robustness. The early degradation detection ability can be explained reasonably in that (i) the gated-diode forward current If and its degradation ΔI f are both entirely constricted to a very localized zone near the drain junction; and (ii) ΔIf/If increases at a rate ∝t0.5 since the generated interface state density increase ∝t0.3, whereas ΔIdsat /Idsat follows a lower rate which ∝t0.15 and Δgm/gm∝t0.3, each due to different aging mechanisms. In addition, oxide trap generation is essentially lacking in our stress experiment, as evidenced by the measured gate induced drain leakage (GIDL) due to band-to-band tunneling
Keywords :
CMOS integrated circuits; MOSFET; hot carriers; process monitoring; production testing; semiconductor device reliability; semiconductor device testing; semiconductor diodes; 3.5 nm; 4.8 nm; CMOS manufacturing processes; MOSFETs; SiO2-Si; aging mechanisms; band-to-band tunneling; degradation detection; drain junction; drive capability; early degradation detection ability; early hot-carrier degradation monitor; forward gated-diode monitor; gate induced drain leakage; gated-diode forward current; hot-carrier induced degradation; hot-carrier robustness; interface state density; localized zone; low-voltage forward gated diode; low-voltage gated diode; monitoring; nondestructive monitoring; oxide trap generation; process evaluation; saturation drive current; scaled MOSFETs; transconductance; weak accumulation/forward mode bias; CMOS process; Degradation; Diodes; Hot carriers; Lead compounds; MOSFETs; Manufacturing industries; Manufacturing processes; Monitoring; Transconductance;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 1999. Proceedings of the 1999 7th International Symposium on the
Print_ISBN :
0-7803-5187-8
DOI :
10.1109/IPFA.1999.791333