Title :
Extraction of parasitic parameters for QFN32
Author :
Xie, Wenjun ; Wen, Guangjun ; Jin, Haiyan
Author_Institution :
Sch. of Commun. & Inf. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
The Quad Flat No Lead or QFN package, a near CSP lead frame, is a promising choice for portable wireless applications such as BluetoothTM and RF SoC. Excellent attributes of this advanced package include miniaturized footprint, good electrical performance and excellent thermal characteristics. In this paper, the parasitic parameters of one signal path for a typical 32 I/O (0.5 mm pitch) QFN package structure, were extracted precisely using Ansoft HFSS and ADS of the Agilent company.
Keywords :
electronic engineering computing; electronics packaging; parameter estimation; ADS; Ansoft HFSS; BluetoothTM; QFN32 package; RF SoC; parasitic parameter extraction; portable wireless applications; quad flat no lead package; Bonding; Chip scale packaging; Circuit simulation; Electronic packaging thermal management; Equivalent circuits; Frequency; Insertion loss; Integrated circuit packaging; Scattering parameters; Wire; ADS; HFSS; Parasitic Parameters; extraction; optimization;
Conference_Titel :
Information, Computing and Telecommunication, 2009. YC-ICT '09. IEEE Youth Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-5074-9
Electronic_ISBN :
978-1-4244-5076-3
DOI :
10.1109/YCICT.2009.5382385
