Abstract :
The following topics are dealt with: semiconductor thermal measurement; multidisciplinary thermal management; liquid cooling systems; thermal tools and calculators; embedded tutorial; data center; packaging advances; heat transfer fundamentals; microelectronics thermal characterization; heat sink geometries; high power density cooling; thermal process and design; materials science.
Keywords :
cooling; electronics packaging; embedded systems; heat sinks; heat transfer; integrated circuits; materials science; thermal management (packaging); data center; embedded tutorial; heat sink geometries; heat transfer; high power density cooling; liquid cooling systems; materials science; microelectronics thermal characterization; multidisciplinary thermal management; packaging advances; semiconductor thermal measurement; thermal calculators; thermal design; thermal process; thermal tools;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-61284-740-5
DOI :
10.1109/STHERM.2011.5767161
