• DocumentCode
    3135056
  • Title

    Analytical Calculation of the Self-Resonant Frequency of Biomedical Telemetry Coils

  • Author

    Yang, Zhi ; Wang, Guoxing ; Liu, Wentai

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Santa Cruz, CA
  • fYear
    2006
  • fDate
    Aug. 30 2006-Sept. 3 2006
  • Firstpage
    5880
  • Lastpage
    5883
  • Abstract
    Inductive link is commonly used in biomedical telemetry as a method to wirelessly transmit power and/or data, where coil is very critical to achieve high efficiency. One of the most important but often ignored parameters of the coils is the self-resonant frequency. Due to the fact that the parasitic capacitances are functions of the geometry and winding sequence of the coil, it is very difficult to calculate the self-resonant frequency. The lack of knowledge about the self-resonant frequency greatly limits the design efficiency, especially when the target operating frequency is high, on the order of tens of MHz. This paper presents an analytical model to calculate the self-resonant frequency of multiple-layer coils. A general model of coils to calculate the total parasitic capacitance is given first and then an analytical equation for self-resonant frequency is obtained. The experimental measurement results demonstrate that the equation can accurately predict the self-resonant frequency, therefore can be used for guiding the coil design
  • Keywords
    biomedical telemetry; capacitance; coils; frequency measurement; analytical equation; biomedical telemetry coils; coil design; coil geometry; coil winding sequence; inductive link; parasitic capacitances; self-resonant frequency; wireless power transmit; Biomedical telemetry; Coils; Equations; Equivalent circuits; Frequency estimation; Geometry; Inductance; Parasitic capacitance; Proximity effect; Skin effect;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1557-170X
  • Print_ISBN
    1-4244-0032-5
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2006.260469
  • Filename
    4463145