DocumentCode
3135216
Title
Thermal imprint feature analysis for face recognition
Author
Cho, Siu-Yeung ; Wang, Lingyu ; Ong, Wen Jin
Author_Institution
Forensics & Security Lab., Nanyang Technol. Univ., Singapore, Singapore
fYear
2009
fDate
5-8 July 2009
Firstpage
1875
Lastpage
1880
Abstract
Recently, vein pattern biometrics has attracted increasing interest from both research and industrial communities. The properties of uniqueness, stability and strong immunity to forgery of the vein patterns would make a potentially good biometric trait offer secure and reliable features for person identity verification. In this paper, a novel approach for personal verification by analyzing the face patterns formed by thermal imaging is presented. A new feature set is proposed to represent the thermal face: the bifurcation points of the thermal pattern and the geographical gravity center of the thermal face region. We proposed to use the Modified Hausdorff Distance to measure the similarity between two feature vectors of the thermal face. The work in this paper shows that the thermal face patterns can provide a reasonable level of discriminating power, and has the potential to be used in the context of biometric applications especially when used in conjunction with other biometric modals.
Keywords
biometrics (access control); face recognition; image representation; infrared imaging; bifurcation point; face recognition; geographical gravity center; modified Hausdorff distance; person identity verification; thermal face pattern representation; thermal imaging; thermal imprint feature analysis; vein pattern biometric; Bifurcation; Biometrics; Face recognition; Forgery; Gravity; Image analysis; Immune system; Pattern analysis; Stability; Veins;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics, 2009. ISIE 2009. IEEE International Symposium on
Conference_Location
Seoul
Print_ISBN
978-1-4244-4347-5
Electronic_ISBN
978-1-4244-4349-9
Type
conf
DOI
10.1109/ISIE.2009.5222105
Filename
5222105
Link To Document