Automated stand for thermal characterization of electronic packages

This paper presents the design and the practical realization of a measurement stand dedicated to thermal characterization of electronic packages. The standard Dual Cold Plate (DCP) solution is enhanced with the Peltier Thermo-Electric Modules (TEMs) and a tensometer bridge. The TEMs are automatically controlled by a special circuit so as to provide either constant case temperature or constant thermal resistance to ambient. The tensometers are used to assure parallel alignment of the layers and to adjust contact thermal resistance between them. The realized stand is thoroughly tested and verified during the measurements of a power diode.