• DocumentCode
    3135371
  • Title

    Applications of vaporizable dielectric fluid cooling for IGBT power semiconductors

  • Author

    Saums, David L.

  • Author_Institution
    DS&A LLC, Amesbury, MA, USA
  • fYear
    2011
  • fDate
    20-24 March 2011
  • Firstpage
    253
  • Lastpage
    264
  • Abstract
    Liquid cooling concepts for power electronics applications have historically used single-phase water/glycol mixtures or deionized water as a primary coolant. Engineered dielectric liquids such as perfluorinated fluorocarbons and fluoroketones are also used, especially in power semiconductor applications for traction and for semiconductor testing, relying on sensible heat transport via a single-phase mechanically pumped loop. Common dielectric fluids such as refrigerants used as coolants in mechanically-pumped two-phase systems have recently been commercialized for cooling IGBT semiconductors in power electronics. Comparative performance data is described. Advanced cooling systems can impact power semiconductor performance, electronic system cost, system volume, and electrical architecture.
  • Keywords
    cooling; insulated gate bipolar transistors; integrated circuit testing; power semiconductor devices; refrigerants; IGBT power semiconductor; coolant; deionized water; dielectric liquid; fluoroketones; heat transport; liquid cooling; perfluorinated fluorocarbons; power electronics; pumped loop; refrigerant; semiconductor testing; single-phase water-glycol mixture; vaporizable dielectric fluid cooling; Cooling; Dielectrics; Fluids; Heating; Insulated gate bipolar transistors; Pumps; Vehicles; Dielectric; IGBT; heat of vaporization; hybrid electric vehicle; liquid cooling; two-phase mechanically pumped liquid cooling loop;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-61284-740-5
  • Type

    conf

  • DOI
    10.1109/STHERM.2011.5767209
  • Filename
    5767209