DocumentCode
3135512
Title
Effects of hydrogen on InP light-emitting devices etched in a methane-hydrogen environment
Author
Beck, Patricia ; Derickson, Dennis ; Kellert, Forrest ; Bagwell, Tim
Author_Institution
Hewlett-Packard Co., Palo Alto, CA, USA
fYear
1995
fDate
9-13 May 1995
Firstpage
624
Lastpage
627
Abstract
Research has been conducted on the physical damage and hydrogenation effects during RF plasma exposure and epitaxial growth in the III-V material system. Device consequences of this damage or chemical alteration have received less attention, particularly in active light emitting devices. This paper discusses these effects for lasers and edge emitting light-emitting diodes (EELEDs) which use a ridge waveguide structure. By using analysis techniques such as SIMS we have concluded that methane-hydrogen reactive ion etching of InP induces hydrogen levels in an active device which are high enough to significantly alter the device properties. The decrease in light output is substantial, but subsequent annealing times as short as 1 min. at 430°C can restore power dramatically
Keywords
III-V semiconductors; annealing; hydrogen; impurity states; indium compounds; interface states; laser reliability; light emitting diodes; quantum well lasers; ridge waveguides; secondary ion mass spectra; semiconductor device reliability; semiconductor growth; sputter etching; vapour phase epitaxial growth; waveguide lasers; 1 mW; 1 min; 20 mW; 430 C; III-V semiconductors; InP; InP-InGaAsP; InP:H; OMVPE; RF plasma exposure; SIMS; annealing; decrease in light output; edge emitting LED; epitaxial growth; hydrogenation effects; light-emitting devices; methane-H2 reactive ion etching; quantum well lasers; reliability testing; ridge waveguide structure; Etching; Hydrogen; III-V semiconductor materials; Indium phosphide; Plasma applications; Plasma chemistry; Plasma devices; Plasma materials processing; Plasma waves; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials, 1995. Conference Proceedings., Seventh International Conference on
Conference_Location
Hokkaido
Print_ISBN
0-7803-2147-2
Type
conf
DOI
10.1109/ICIPRM.1995.522221
Filename
522221
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