DocumentCode
3135568
Title
Carbon nanotubes based engineering materials for thermal management applications
Author
Datsyuk, Vitaliy ; Firkowska, Izabela ; Gharagozloo-Hubmann, Kati ; Lisunova, Milana ; Vogt, Anna-Maria ; Boden, André ; Kasimir, Maria ; Trotsenko, Svitlana ; Czempiel, Gregor ; Reich, Stephanie
Author_Institution
Inst. fur Exp. Phys., Freie Univ. Berlin, Berlin, Germany
fYear
2011
fDate
20-24 March 2011
Firstpage
325
Lastpage
332
Abstract
We developed innovative solutions for reaching high performance in carbon-nanotube-filled engineering materials. Electrospinning was applied to improve the thermal conductivity in polymer composites via the alignment of nanotubes in a polymer matrix. Alignment was achieved by flow-confinement and charge-induced alignment during electrospinning. Additionally, the use of liquid crystal polymer as a matrix increased the degree of alignment leading to the remarkable increase of the thermal conductivity in composites by a factor 33. We developed the reduction from method to produce metal-matrix composites filled with carbon nanotubes. We were able to engineer the coefficient of thermal expansion (CTE) of the copper composite, for example 3 wt% of carbon nanotubes added to copper yielded CTEs comparable with ceramics and semiconductors. In situ thermal polymerization of natural oils (plant and fish) was applied to produce nanotubes-based thermal greases. This method creates novel, environmentally friendly thermal grease with excellent thermal conductivity (increased by a factor 12), that is easy to handle compound and to remove. Such thermal greases can be applied to surfaces by various methods, including screen printing, and demonstrate good thermal stability, reduced thermal expansion, and no pumping-out effect.
Keywords
carbon nanotubes; composite materials; electrospinning; liquid crystal polymers; polymerisation; thermal conductivity; thermal expansion; thermal management (packaging); thermal stability; C-Cu; carbon nanotubes; coefficient of thermal expansion; electrospinning; engineering materials; liquid crystal polymer; metal-matrix composites; polymer composites; polymer matrix; screen printing; thermal conductivity; thermal management applications; thermal polymerization; thermal stability; Carbon nanotubes; Conductivity; Copper; Optical fiber polarization; Polymers; Thermal conductivity; Carbon nanotube; coefficient of thermal expansion; engineering composites; metal; polymer; polyol; thermal conductivity; thermal interface material;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
978-1-61284-740-5
Type
conf
DOI
10.1109/STHERM.2011.5767219
Filename
5767219
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