Title :
Development of an advanced thermal interface material for high power devices
Author :
Nguyen, My ; Brandi, Jason
Author_Institution :
Henkel Corp., Irvine, CA, USA
Abstract :
The cure reactions for conventional flexible epoxy resins are generally slow and have out-gassing and branching site reactions. As a result, these resin types have significant hardening after long-term, high-temperature exposure which makes them unsuitable for thermal interface applications. To address these challenges, a new epoxy resin system has been developed for thermal interface materials (TIMs). The main characteristics of the new resin are: - High thermal stability - No branching - Hydrophobic - Stable at room temperature Development and characterization of a new type of TIM will be discussed.
Keywords :
resins; thermal stability; advanced thermal interface material; cure reaction; flexible epoxy resin; high power device; high temperature exposure; high thermal stability; thermal interface application; Resins; Thermal conductivity; Thermal degradation; Thermal resistance; Thermal stability; TIM1; Thermal Interface; epoxy gel; flip-chip BGA; solder;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-61284-740-5
DOI :
10.1109/STHERM.2011.5767220
