• DocumentCode
    3135613
  • Title

    Microwave characterization of materials for telecommunication systems

  • Author

    Mazierska, Janina

  • fYear
    2009
  • fDate
    20-21 Sept. 2009
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Summary form only given. Novel low loss materials are needed to achieve miniaturization and further advances in wireless communications with precisely known microwave properties. Measurements of complex permittivity of low loss dielectric materials (especially anisotropic) in a wide range of temperatures still represent a challenging issue. Accuracy of surface resistance tests of superconducting materials can be low in some cases, and characterization of metamaterials is done only for one polarization and one incident angle, what is rather unsatisfactory. Accuracy of measurements is also determined by accuracy in determination of unloaded Qo-factor of test fixtures. Hence progress in microwave characterization of novel materials is also necessary. In this presentation a review of test resonators and a precise technique to measure the Qo-factor will be given. Also measurement results of complex permittivity of several low loss dielectrics and High Temperature superconducting materials will be shown.
  • Keywords
    dielectric materials; high-temperature superconductors; materials testing; microwave materials; permittivity measurement; radio networks; surface resistance; Qo-factor; complex permittivity measurements; high temperature superconducting materials; low loss dielectric materials; microwave characterization; surface resistance tests; telecommunication systems; test resonators; wireless communications; Dielectric loss measurement; Dielectric materials; Dielectric measurements; Electrical resistance measurement; Loss measurement; Permittivity measurement; Superconducting materials; Surface resistance; Testing; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information, Computing and Telecommunication, 2009. YC-ICT '09. IEEE Youth Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-5074-9
  • Electronic_ISBN
    978-1-4244-5076-3
  • Type

    conf

  • DOI
    10.1109/YCICT.2009.5382463
  • Filename
    5382463